Escatec adds UV to die bonder to enhance assembly precision

EMS provider Escatec has integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.

The company has built a customised UV-curing system with two 365nm light sources on the die bond head of their Tresky T6000 fully automatic machine.

This enables exact positioning of components and direct snap-curing required during the passive alignment process.

The enhancement accelerates and improves the process of adhesive curing during the pick-and-place operations, streamlines the manufacturing process overall and boosts the accuracy of component placement, which is critical for the assembly of complex electronic parts.

Micro-assembly processes traditionally face challenges such as achieving high precision and managing adhesive curing times effectively.

The UV light feature directly addresses these issues by significantly reducing the time required for the adhesive to set, which in turn, speeds up the entire assembly process.

The integration of UV light technology into ESCATEC’s die bonding process brings several benefits to clients:

Increased Precision: The precise control over UV exposure ensures accurate placement and bonding of components, crucial to produce high-quality electronic devices.

. Quality Improvement: Improved bonding techniques increase the durability and reliability of the finished products, meeting the high standards required in the electronics industry.

• New possibilities: There are some chips that need to vibrate, such as piezos, which means they must ‘float’ in the air, which makes this process perfectly suitable.