TI eyes AI and in-house manufacturing

Increasing direct business and ensuring manufacturing locations close to customers are two goals for Texas Instruments, confirmed EMEA president, Stefan Bruder (pictured).

“The goal is to get inhouse manufacturing to 95% by 2030,” he told Electronics Weekly.

The company has tripled its manufacturing capacity to 9,000 sq m, with two fabs ramping up at present and five others being built in addition to two assembly and test locations equipped and ramping up at present.

It has also increased direct business sales from 30% to 70% via its website and API, Bruder said.

What is important, he continued is the affordability for customers and the reduced system cost through the use of 300mm wafers resulting in improved yield and costs.

Another impetus is to enable customers to use AI for embedded and edge designs, said Bruder. At electronica in Munich, the company highlighted the increasing use of AI, launching the P55 devices as part of the C2000 microcontroller series. It has an integrated neural processing unit designed to detect arc faults in solar inverters.

The other focus in Munich was GaN, with a demonstration using it in a solar inverter and one in a motor control application to illustrate its energy density with a reduced requirement for heat sinking or heat management, said Bruder.