Electronica: Exude thermal gap filler where you need it

Chomerics announced a cure-in-place thermal gap filler material that remains flexible after curing, at Elecronica today.

CIP 60 offers 6W/mK conductivity, and cures to a Shore hardness of 50 (ASTM 2240 method).

“This not only provides an alternative to hard-curing dispensable materials in electronics cooling applications, but also offers an improvement over standard application methods associated with thermal gap filler pads,” claimed the company.

It is delivered as two components, and used in a 1:1 mix ratio.

The material is packaged in a variety of sizes, from 50cm³ dual-chamber cartridges with self-mixing nozzles for manual application, to 25kg buckets for automated mixing and application, and has “an exceptional flow rate, dispensable in high volumes,” said Chomerics.

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Once deposited, it is formulated to resist sagging during curing, and cures in one hour at 110°C, or 24 hours at 25°C.

Once cured, operation is over -50 to +200°C, dielectric strength is 125kVac/mm (ASTM D149), volume resistivity 10¹³Ωcm (ASTM D257), dielectric constant 69.3 (1MHz, ASTM D150) and dissipation factor 0.006 (1MHz, CHO-TM-TP13).

Applications are foreseen where heat transfer is needed in irregular geometries, such as with multi-height components on a PCB where excessive force must be avoided – mostly in automotive systems, but also in consumer products and enterprise solid-state drives.

Find CIP 60 on this web page or at Electronica in hall B3 on stand 236 (12 – 15 November, Munich).

Chomerics also announced a thermal gap pad with low oil-bleed and low oil migration at Electronica